IBASE MB879,MB890 & MB896F M/B;Commell LV-675 & LV-677 M/B; VIA EPIA PN M/B (VIA VB6002 Board With Intel CPU) (PN) Those M/Bs with hole-to-hole distance for heat device is 41x41mm
HP35
GS-L09
VIA EPIA NX M/B
HP37
GS-L05
VIA CN M/B VIA EN M/B
HP38
GS-L05
VIA EX & LT M/B
HP39
GS-L06,GW-01
Those M/Bs with hole-to-hole distance for heat device is 41x41mm
HP41
GS-L06,GW-01
VIA EX & LT M/B
HP42
GS-L10
MSI MS-7265VER1.0
HP43
GW-01
Ò×˼‚Ü 915 M/B
HP45
GA-L01,GD-L01,GS-L01, GS-L02,GS-L02L
VIA EPIA-LN M/B
HP46
GS-L05
Intel-D201GLY
HP47
GS-L06,GW-01
Intel-D201GLY
HP50
GA-L01
Intel D201 GLY M/B
HP51
GS-L05
Jetway J7F5
HP52
GS-L02
Jetway J7F5 (Need to make modification on case structure.)